Various requirements for printed circuit boards make the use of different circuit board substrates necessary.
Whereas for many standard applications the classical FR4 material is sufficient, possibly in high Tg version (for improved thermo-mechanical properties), for other areas (such as high frequencies) alternate materials are absolutely required.
The following information is intended as a abstract summary of all available material typesand their fundamental properties, to make it easier for you to make a selection according to the required field of application.
Laminates Available
FR-1–Lower cost laminate
FR-2–Lower cost laminate
CEM-1– Low cost single sided
CEM-3 – Alternative to FR-4
FR-4 – Industry Standard
High Tg FR-4 – High temperature applications
Aluminum Metail Core – Regular and high Thermal Conductivity Rate
Please note:
- The selected materials may be replaced by technically equivalent or similar products, according to available stocks on hand.
- Tg 170 is popular in LED industry, because heat dissipation of LED is higher than normal electronic components, and same structure of FR4 board is much cheaper than that of MCPCB. If working temperature is higher than 170/180C, such as 200C, 280C, or even higher, then you’d better use Ceramic board which can go through -55~880C.
Materials for rigid circuit boards –Shengyi Brand
S1141&S1000 : Regular Tg value and medium tg value usage.
S1170&S1000-2: TG 170
Materials for rigid circuit boards –King Board Brand
Default: KB 6160 for TG 135 and KB6167 for TG170
Other brands: Nanya, ILM-GDM
Material for Metal Core PCB
Base material: Aluminum/Copper/Iron Alloy
Thermal Conductivity (dielectrial layer): 0.8, 1.5, 2.0, 3.0 W/m.K.
Board Thickness: 0.5mm~3.0mm(0.02″~0.12″)
Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ
