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Home > Engineering/Technical > FPC and RFPC capability
FPC and RFPC Standard Capability
| Options- FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
| Quantity | from 1 piece to mass production |
| Number of layers | up to 6 layers |
| Material thickness | 0,06mm to 0,2mm |
| Copper thickness (base) | 5µm, 9µm, 12µm, 18µm, 28~35µm* |
| *2layer standard starting from 18µm base copper, plated up to ~28µm | |
| Material colour | beige/fawn |
| Base material | adesive-less polyimide (PI), polyethylen (PET) |
| Operating temperature | up to around 200° C (Tg 260), adesive-less polyimide (PI) |
| Copper type | Elektrolytic deposit (ED) or rolled annealed (RA) |
| Silk print layer | none, top, bottom, double sided |
| Solder mask colour | yellow, green |
| Cover lay | yellow polyimide |
| Combination solder mask & cover lay | possible |
| Silk print colour | black, blue, yellow, white, red |
| Via-Filling (no copper lid) | possible (with cover lay) |
| Stiffener | several thicknesses, FR4 or polyimide |
| 3M-adhesive | possible |
| E-Test | possible |
| Plugging Plugging (with copper lid, e.g. for „via-in-pad“ technology) | possible |
| Peelable mask | possible |
| Chamfering/beveling | not possible |
| Surface finish | immersion tin, immersion gold (ENIG), immersion silver, OSP |
| Connector gold plating | possible |
| Long term tempering | possible |
| Maximum FPC size 1 and 2 layers | 235x585mm² |
| Maximum FPC size 4 and 6 layers | 220x320mm² |
| Lead time options 1- and 2 layers FPCs | from 10WD |
| Lead time options 4- and 6 layers FPCs | ab 15AT |
| Routing | not possible |
| V-Cut / scoring | possible, inside fixture/stiffener |
| Jump scoring | not possible |
| Punching (soft tooling) | possible |
| Punching (hard tooling) | possible |
| Hand Cut | possible |
| Hand cut & soft tooling combination | possible |
| Counter sink drills / tapped holes | not possible |
| Special multilayer stack-ups | possible |
| Panel production - FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
| V-Cut / scoring panel | possible |
| V-Cut - punching panel (combination) | possible |
| Multi Panel (more than one 1 layout on a panel) | possible |
| Panel setup (chosen by Caring Circuit) | possible |
| Panel setup (according to drawing) | possible |
| PTH-drills (plated drills) - FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
| Smallest Drill 5µm to 18µm (final diameter) | 0,15mm |
| Smallest Drill 28~35µm (final diameter) | 0,15mm |
| Smallest Drill 70µm (final diameter) | 0,20mm |
| Smallest annular ring 5µm to 18µm | 0,10mm |
| Smallest annular ring 28~35µm | 0,10mm |
| Smallest annular ring 70µm | 0,15mm |
| Possible drill sizes | up to 5,5mm in 0,05mm steps |
| drills >5,5mm | punched |
| Smallest hole-to-hole distance for 0,2mm to 2,0mm drill diameter (outer edge to outer edge) | 0,40mm |
| Smallest hole-to-hole distance for 2,05mm to 5,5mm drill diameter (outer edge to outer edge) | 0,50mm |
| Intersecting drills | 0,7 to 2,0mm |
| Half open drills on PCB edge (Half open PTH) | possible |
| NPTH-drills (non-plated drills) - FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
| Smallest drill size (final diameter) | 0,30mm |
| Possible drill sizes | 0,30mm to 5,5mm in 0,05mm steps |
| Copper clearance / distance to copper | 0,20mm |
| Drills >5,5mm | punched |
| Smallest distance from drill to outer edge | 0,50mm |
| Smallest hole-to-hole distance for 0,2mm to 2,0mm drill diameter (outer edge to outer edge) | 0,40mm |
| mallest hole-to-hole distance for 2,05mm to 5,5mm drill diameter (outer edge to outer edge) | 0,50mm |
| Intersecting drills | replaced by punching |
| NPTH drills in copper area (without clearance) | on explicit notification |
| Blind Vias - FPCs and RFPC Prototypes to Mass Production | on explicit enquiry |
| Smallest blind via (final diameter) | 0,20mm |
| Smallest Aspect-Ratio | 1 |
| Smallest annular ring | 0,15mm |
| Buried Vias - FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
| Smallest buried via (final diameter) | 0,20mm |
| Slots (non-plated) - FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
| Inner slots NPTH | Hard tool punching |
| Smallest inner slot NPTH | from 0,5mm up, hard tool punching |
| Smallest radius (inner corners) NPTH | acute angle |
| Slots (plated) - FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
| Inner slots PTH | possible |
| Smallest inner slot PTH | from 0,5mm hard tool punching |
| Edge plating (outer edge) | possible |
| Special outline paths with plating (inner) | possible |
| Smallest radius (inner corner, final) PTH | right angle |
| Smallest annular ring | 0,15mm |
| Copper Layers (outer) - FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
| Smallest trace 5µm | 0,03mm |
| Smallest trace 9µm | 0,06mm |
| Smallest trace 18µm | 0,09mm |
| Smallest trace 28~35µm | 0,10mm |
| Smallest trace 70µm | 0,20mm |
| Smallest trace-to-trace distance 18µm | 0,09mm |
| Smallest trace-to-trace distance 28~35µm | 0,10mm |
| Smallest trace-to-trace distance 70µm | 0,20mm |
| Smallest drill-pad diameter | 0,40mm |
| Smallest copper clearance to inner edges (slots) | 0,20mm oder 0,0mm (plated) |
| Smallest copper clearance to outer edges | 0,20mm oder 0,0mm (metallisiert) |
| Smallest copper clearance to outer edges (V-Cut) | 0,50mm |
| Copper Layers (inner) - Multilayer FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
| Smallest trace 5 to 9µm | 0,04mm |
| Smallest trace 18µm | 0,09mm |
| Smallest trace 28~35µm | 0,10mm |
| Smallest trace 70µm | 0,20mm |
| Smallest trace-to-trace distance 5 to 9µm | 0,04mm |
| Smallest trace-to-trace distance 18µm | 0,09mm |
| Smallest trace-to-trace distance 28~35µm | 0,10mm |
| Smallest trace-to-trace distance 70µm | 0,20mm |
| Smallest drill-pad diameter | 0,40mm |
| Smallest copper clearance to outer edges | 0,30mm |
| Smallest copper clearance to inner edges (slots) | 0,35mm |
| Smallest copper clearance to drills | 0,30mm |
| Solder Mask - FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
Smallest
solder mask web (straight)  |
0,08mm |
Smallest
solder mask web (round) 
|
0,05mm |
Smallest
size around copper pad 
|
<0mm |
| Smallest text lines | 0,25mm |
| Cover Lay (punched / drilled / lasered) - FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
| Smallest rectangular pad (clearance) | 2x2mm |
|
Smallest
cover lay web (straight)
|
2,0mm |
|
Smallest
cover lay web (round)
|
1,0mm |
|
Smallest
size around copper pad
|
<0mm |
| Smallest text lines | not possible |
| Silk Print - FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
| Smallest lines | 0,15mm |
| Smallest distance between lines | 0,15mm |
| Minimum clearance to copper pads | 0,15mm |
| Carbon Print - FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
| Smallest pad-to-pad distance | 0,50mm |
| Tolerances, Values, Marks & Norms - FPCs and RFPC Prototypes to Mass Production | Caring Circuit Capability |
| Max. offset drill centre to centre of reference | 0,075mm |
| Max. offset solder stop (laquer or cover lay) / copper structures | 0,10mm |
| Finished drill sizes PTH (up to 3mm) | -0/+0,10mm |
| Finished drill sizes PTH (> 3mm) | -0/+0,10mm |
| Finished drill sizes NPTH (up to 6mm) | -0/+0,10mm |
| Finished drill sizes NPTH (>6mm) | -0/+0,10mm |
| Outline | +/-0,10mm |
| Max. offset outline/copper structures | +/-0,10mm |
| Scoring depth | +/-0,20mm |
| Max. offset scoring/copper structures | +/-0,20mm |
| Etch tolerance copper thickness 5µm | +0/-0,01mm |
| Etch tolerance copper thickness 9µm | +0/-0,01mm |
| Etch tolerance copper thickness 18µm | +0/-0,02mm |
| Etch tolerance copper thickness 28~35µm | +0/-0,03mm |
| Etch tolerance copper thickness 70µm | +0/-0,04mm |
| Material thickness tolerance | differs, please enquire |
| Copper thickness tolerance | +/-10% |
| Thickness immersion tin | >= 1,0µm |
| Thickness tin (HAL-lead free) | nicht möglich |
| Immersion gold for soldering purpose (nickel thickness) | 2,5µm to 5µm |
| Immersion gold for soldering purpose (gold thickness) | 0,05µm to 0,075µm |
| Immersion gold for gold-wire bonding (nickel thickness) | not possible |
| Immersion gold for gold-wire bonding (gold thickness) | not possible |
| Immersion gold for aluminium-wire bonding (nickel thickness) | 2,5µm to 5µm |
| Immersion gold for aluminium-wire bonding (gold thichicht) | 0,05µm to 0,075µm |
| Elctrolytic soft gold for connectors, soft, bonding (nickel thickness) | 4µm to 8µm |
| Elctrolytic soft gold for connectors, soft, bonding (gold thickness) | 0,2µm to 0,3µm |
| Elctrolytic hard gold for connectors, hard, no bonding (nickel thickness) | 4µm to 8µm |
| Elctrolytic hard gold for connectors, hard, no bonding (gold thickness) | 0,8µm to 1µm |
| Solder mask thickness | >15µm |
| Cover lay thickness | from 12,5µm |
| Adhesive thickness Polyimid base material to copper (epoxy) | from 12,5µm |
| Adhesive thickness Polyimid-cover lay to copper | from 12,5µm |
| Copper thickness inside plated holes (PTH) 5µm to18µm | at least 6µm |
| Copper thickness inside plated holes (PTH) 28~35µm | at least 10µm |
| Copper thickness inside plated holes (PTH) 70µm | at least 12µm |
| Connector tolerance with siffener (total width) | +/-0,075mm |
| Connector tolerance with siffener (outline to pad) | +/-0,075mm |
| Chamfer angle | not possible |
| Base material RoHS-compliant | yes alway |
| Surface finish RoHS-compliant | yes alway |
| IPC-norm | IPC-6013 - Class 1, 2 or 3 |
| Insert date code (WW/YY) | possible, please advise in case of order/enquiry |
| Insert supplier logo (Caring Circuit) | possible, please advise in case of order/enquiry |
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